A composition and method for stripping tin and solder and the underlying tin-copper alloy from the copper substrate of a printed circuit board is presented. The liquid includes an aqueous solution of nitric acid in an amount sufficient to dissolve solder and tin, a source of ferric ions in an amount sufficient to dissolve the tin-copper alloy, and a source of halide ions in an amount. Solder stripping solution - Circuit Chemistry. Dilute 1 jar CBX circuit board stripping powder with water to make 1 gallon of solution. Time 1 minute 30 seconds for gold fingers electronic circuit board.
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